AMD CTO e bua ka Chiplet: Nako ea ho tiisoa ha lifoto tsa motlakase ea tla

Baokameli ba khamphani ea AMD chip ba boletse hore li-processor tsa AMD tsa kamoso li ka ba le li-accelerator tse ikhethileng tsa domain, esita le li-accelerator tse ling li entsoe ke batho ba boraro.

Motlatsi oa Motlatsi e Moholo Sam Naffziger o buile le Ofisiri e ka Sehloohong ea Theknoloji ea AMD Mark Papermaster ka video e lokollotsoeng ka Laboraro, a hatisa bohlokoa ba maemo a manyane a chip.

"Li-accelerator tse ikhethileng ka domain, ke eona tsela e molemohali ea ho fumana ts'ebetso e ntle ka ho fetisisa ka dolara ka watt.Ka hona, ho hlokahala ka ho feletseng bakeng sa tsoelo-pele.U ke ke ua khona ho etsa lihlahisoa tse ikhethileng sebakeng se seng le se seng, kahoo seo re ka se etsang ke ho ba le "chip ecosystem" e nyane - ha e le hantle laeborari, "Naffziger o hlalositse.

O ne a bua ka Universal Chiplet Interconnect Express (UCIe), tekanyetso e bulehileng ea puisano ea Chiplet e 'nileng ea e-ba teng ho tloha ha e thehoa qalong ea 2022. E hapile tšehetso e atileng ho tsoa ho libapali tse kholo tsa indasteri tse kang AMD, Arm, Intel le Nvidia, hape. joalo ka mefuta e meng e mengata e menyane.

Ho tloha ha e qala moloko oa pele oa li-processor tsa Ryzen le Epyc ka 2017, AMD esale e le ka pele ho meralo e nyane ea chip.Ho tloha ka nako eo, laeborari ea House of Zen ea li-chips tse nyane e se e holile ho kenyelletsa li-compute tse ngata, I/O, le li-graphics chips, li li kopanya le ho li kenyelletsa ho li-processor tsa eona tsa bareki le setsi sa data.

Mohlala oa mokhoa ona o ka fumanoa ho AMD's Instinct MI300A APU, e qalileng ka Tšitoe 2023, E pakiloe ka lichifi tse nyane tse 13 (li-chips tse 'ne tsa I/O, li-chips tse tšeletseng tsa GPU, le li-CPU tse tharo) le mekotla e robeli ea HBM3.

Naffziger o boletse hore nakong e tlang, litekanyetso tse kang UCIe li ka lumella lichifi tse nyane tse hahiloeng ke batho ba boraro ho fumana tsela ea tsona ea liphutheloana tsa AMD.O boletse hore silicon photonic interconnect - thekenoloji e ka nolofatsang libotlolo tsa bandwidth - e le ho ba le monyetla oa ho tlisa li-chips tse nyane tsa mokha oa boraro lihlahisoa tsa AMD.

Naffziger o lumela hore ntle le khokahano ea chip ea matla a tlase, theknoloji ha e khonehe.

"Lebaka leo ka lona u khethang khokahano ea optical ke hobane u batla bandwidth e kholo," oa hlalosa.Kahoo o hloka matla a tlase hanyane ho fihlela seo, 'me chip e nyane ka har'a sephutheloana ke tsela ea ho fumana sebopeho se tlase sa matla. ”O boetse a re o nahana hore phetoho ea ho kopanya li-optics e "tla."

Ho fihlela seo, li-startups tse 'maloa tsa silicon photonics li se li ntse li hlahisa lihlahisoa tse ka etsang joalo.Ka mohlala, Ayar Labs, e hlahisitse chip ea photonic e lumellanang le UCIe e kopantsoeng le prototype graphics analytics accelerator Intel e hahiloeng selemong se fetileng.

Hore na li-chips tse nyane tsa mokha oa boraro (lifotonics kapa mahlale a mang) li tla iphumanela lihlahisoa tsa AMD ho sa ntse ho tla bonahala.Joalo ka ha re se re tlalehile pejana, maemo ke e 'ngoe ea liqholotso tse ngata tse hlokang ho hlōloa ho lumella li-chips tse ngata tse fapaneng.Re kopile AMD bakeng sa tlhaiso-leseling e batsi mabapi le leano la bona le lenyane la chip mme re tla u tsebisa haeba re ka fumana karabo.

AMD e kile ea fana ka lichifi tsa eona tse nyane ho baetsi ba li-chipmaker.Karolo ea Intel's Kaby Lake-G, e hlahisitsoeng ka 2017, e sebelisa motheo oa moloko oa 8 oa Chipzilla hammoho le RX Vega Gpus ea AMD.Karolo e sa tsoa hlaha hape ho boto ea Topton's NAS.