Litšenyehelo tsa chelete ea Semiconductor li fokotseha ka 2024

Mopresidente oa US Joe Biden ka Laboraro o phatlalalitse tumellano ea ho fa Intel ka $ 8.5 bilione ka lichelete tse tobileng le $ 11 bilione ea likalimo tlas'a Molao oa Chip le Saense.Intel e tla sebelisa chelete bakeng sa masela a Arizona, Ohio, New Mexico le Oregon.Joalo ka ha re tlalehile koranteng ea rona ea December 2023, Molao oa CHIPS o fana ka kakaretso ea $52.7 bilione bakeng sa indasteri ea semiconductor ea US, ho kenyeletsoa $39 bilione ho khothatso ea tlhahiso.Pele ho thuso ea Intel, Molao oa CHIPS o ne o phatlalalitse kakaretso ea $ 1.7 bilione ea lithuso ho GlobalFoundries, Microchip Technology le BAE Systems, ho latela Semiconductor Industry Association (SIA).

Likhaello tse tlas'a Molao oa CHIPS li tsamaile butle, 'me tefello ea pele ha e ea phatlalatsoa ho fihlela nako e fetang selemo ka mor'a hore e fete.Merero e meng e meholo ea Amerika e liehile ka lebaka la litefo tse liehang.TSMC e boetse e hlokometse hore ho ne ho le thata ho fumana basebetsi ba tšoanelehang ba kaho.Intel e re tieho e boetse e bakoa ke ho lieha ha thekiso.

Linaha tse ling le tsona li abile lichelete ho matlafatsa tlhahiso ea li-semiconductor.Ka Loetse 2023, European Union e ile ea amohela European Chip Act, e fanang ka li-euro tse limilione tse likete tse 43 (liranta tse limilione tse likete tse 47) tsa matsete a sechaba le a poraefete indastering ea semiconductor.Ka Pulungoana 2023, Japane e ile ea abela li-yen tse libilione tse peli (liranta tse libilione tse 13) bakeng sa tlhahiso ea li-semiconductor.Taiwan e entse molao ka Pherekhong 2024 ho fana ka khefutso ea lekhetho bakeng sa lik'hamphani tsa semiconductor.Korea Boroa e fetisitse bili ka Hlakubele 2023 ho fana ka khefutso ea lekhetho bakeng sa mahlale a maano, ho kenyeletsoa li-semiconductors.China e lebelletsoe ho theha letlole le tšehelitsoeng ke mmuso la $ 40 bilione ho thusa indasteri ea eona ea semiconductor.

Ke chebello efe ea tšebeliso ea chelete (CapEx) indastering ea semiconductor selemong see?Molao oa CHIPS o reretsoe ho khothaletsa tšebeliso ea chelete, empa boholo ba tšusumetso e ke ke ea utloahala ho fihlela ka mor'a 2024. Mmaraka oa semiconductor o theohile ka liphesente tse 8.2 selemong se fetileng, 'me lik'hamphani tse ngata li hlokolosi ka tšebeliso ea chelete ka 2024. Re le Semiconductor Intelligence. hakanya kakaretso ea semiconductor capex bakeng sa 2023 ho $169 bilione, e theohile ka 7% ho tloha 2022. Re bolela esale pele ho theoha ha 2% ea tšebeliso ea chelete ka 2024.

Karolelano ea litšenyehelo tsa chelete ea semiconductor ho boholo ba 'maraka e tloha holimo ho 34% ho ea tlase ho 12%.Kakaretso ea lilemo tse hlano e pakeng tsa 28% le 18%.Bakeng sa nako eohle ho tloha 1980 ho isa 2023, kakaretso ea litšenyehelo tsa lichelete e emela 23% ea 'maraka oa semiconductor.Ho sa tsotellehe ho feto-fetoha ha maemo, mokhoa oa nako e telele oa karolelano o 'nile oa lumellana hantle.Ho ipapisitsoe le kholo e matla ea 'maraka e lebelletsoeng le ho fokotseha ha capex, re lebelletse hore karolelano e tla theoha ho tloha ho 32% ka 2023 ho isa ho 27% ka 2024.

Boholo ba likhakanyo tsa kholo ea 'maraka oa semiconductor ka 2024 li maemong a 13% ho isa ho 20%.Polelo ea rona ea bohlale ba semiconductor ke 18%.Haeba ts'ebetso ea 2024 e le matla joalo ka ha ho lebelletsoe, k'hamphani e ka eketsa merero ea eona ea tšebeliso ea chelete ka nako.Re bone phetoho e ntle ho semiconductor capex ka 2024.